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Stress Analysis Of The Microelectronic Packages By Moire Interferometry.

About this Digital Document

Full Title
Stress Analysis Of The Microelectronic Packages By Moire Interferometry.
Contributor(s)
Date Issued
1995
Language
English
Type
Department name
Mechanical Engineering and Mechanics
Media type
Tsao, . P.-H. (1995). Stress Analysis Of The Microelectronic Packages By Moire Interferometry. (1–). https://preserve.lehigh.edu/lehigh-scholarship/graduate-publications-theses-dissertations/theses-dissertations/stress-7
Tsao, Pei-Haw. 1995. “Stress Analysis Of The Microelectronic Packages By Moire Interferometry”. https://preserve.lehigh.edu/lehigh-scholarship/graduate-publications-theses-dissertations/theses-dissertations/stress-7.
Tsao, Pei-Haw. Stress Analysis Of The Microelectronic Packages By Moire Interferometry. 1995, https://preserve.lehigh.edu/lehigh-scholarship/graduate-publications-theses-dissertations/theses-dissertations/stress-7.