Document
About this Digital Document
Full Title
Stress Analysis Of The Microelectronic Packages By Moire Interferometry.
Member of
Contributor(s)
Creator: Tsao, Pei-Haw - Lehigh University
Date Issued
1995
Language
English
Type
Genre
Department name
Mechanical Engineering and Mechanics
Media type
Tsao, . P.-H. (1995). Stress Analysis Of The Microelectronic Packages By Moire Interferometry. (1–). https://preserve.lehigh.edu/lehigh-scholarship/graduate-publications-theses-dissertations/theses-dissertations/stress-7
Tsao, Pei-Haw. 1995. “Stress Analysis Of The Microelectronic Packages By Moire Interferometry”. https://preserve.lehigh.edu/lehigh-scholarship/graduate-publications-theses-dissertations/theses-dissertations/stress-7.
Tsao, Pei-Haw. Stress Analysis Of The Microelectronic Packages By Moire Interferometry. 1995, https://preserve.lehigh.edu/lehigh-scholarship/graduate-publications-theses-dissertations/theses-dissertations/stress-7.