Text

The Applications of Enriched Finite Element Analysis in Electronic Packaging

About this Digital Document

Full Title
The Applications of Enriched Finite Element Analysis in Electronic Packaging
Member of
Theses and Dissertations
Contributor(s)
Creator: Chen, Yi
Thesis advisor: Nied, Herman F.
Publisher
Lehigh University
Date Issued
2012-05
Language
English
Type
Text
Genre
theses
Form
electronic documents
Department name
Mechanical Engineering
Digital Format
electronic documents
Media type
application/pdf
Creator role
Graduate Student
Identifier
895662370
https://asa.lib.lehigh.edu/Record/10535300
Subject (LCSH)
Mechanical engineering
Keywords
ANSYS
Electronic Packaging
Enriched Finite Element
Fatigue
Fracture Mechanics
Chen, . Y. (2012). The Applications of Enriched Finite Element Analysis in Electronic Packaging (1–). https://preserve.lehigh.edu/lehigh-scholarship/graduate-publications-theses-dissertations/theses-dissertations/applications-1
Chen, Yi. The Applications of Enriched Finite Element Analysis in Electronic Packaging. May 2012, https://preserve.lehigh.edu/lehigh-scholarship/graduate-publications-theses-dissertations/theses-dissertations/applications-1.