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Vibration Energy Coupling Behavior of Rolling Mills under Double Disturbance Conditions

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The operation of the world’s first multimode continuous casting and rolling F3 (3rd finishing mill stand) finishing mill was hampered by frequent vibrations. Mill vibrations were found to be caused by the transmission and coupling of vibration energy flow. In this study, an overall finite element model of the F3 stand is established based on the structural sound intensity method and harmonic response analysis method, and then, the intrinsic energy flow modes and energy flow harmonic response of the F3 stand are obtained. Further, the effects of the steady-state rolling force variation, preload torque variation, rolling force fluctuation, torque fluctuation, and its phase angle difference on the vibration energy flow of the mill are analyzed. Finally, the effects of the mill damping ratio, strip width, and strip modulus on the vibration energy flow under double dynamic load are discussed to reveal the inherent characteristics of the mill vibration energy flow. The results show that the vibration energy flow of the mill increases with the increase of strip modulus, rolling force, and moment fluctuation; the phase angle difference of rolling moment shows a “V” trend change on the vibration energy flow; the change of strip width has a greater effect on the vibration energy flow of the vertical system; and for the damping ratio of 0.01–0.1, the reduction of the vibration energy flow at all excitation frequencies is obvious.

Contributor(s)
Author: Wang, Lidong
Author: Wang, Shen
Author: Jia, Xingdou
Publisher
MDPI AG
Date Issued
2023-02-20
Language
English
Type
Genre
Form
electronic document
Media type
Creator role
Faculty
Identifier
2079-9292
Has this item been published elsewhere?
Volume
12
Volume
4
Wang, . L., Wang, . S., Jia, . X., Wang, . X., & Yan, . X. (2023). (Vols. 4). https://doi.org/10.3390/electronics12041061
Wang, Lidong, Shen Wang, Xingdou Jia, Xiaoling Wang, and Xiaoqiang Yan. 2023. https://doi.org/10.3390/electronics12041061.
Wang, Lidong, et al. 20 Feb. 2023, https://doi.org/10.3390/electronics12041061.