Date

1973

Document Type

Thesis

Degree

Master of Science

Department

Materials Science and Engineering

First Adviser

Pense, Alan W.

Abstract

Thermocompression bonding has been investigated by deforming tapes against a gold film plated on a rigid substrate. This results in plane strain deformation, but otherwise conditions are as used in industrial practice.

Comments

Former department name: Metallurgy and Materials Science

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