Master of Science
Materials Science and Engineering
Pense, Alan W.
Thermocompression bonding has been investigated by deforming tapes against a gold film plated on a rigid substrate. This results in plane strain deformation, but otherwise conditions are as used in industrial practice.
Dries, Leon, "Deformation and structural changes occuring at the interface during gold-gold thermocompression bonding" (1973). Theses and Dissertations. 4205.