Date

1972

Document Type

Thesis

Degree

Master of Science

Department

Electrical Engineering

First Adviser

Leenov, Daniel

Abstract

The bilevel substrate designed for interconnecting integrated circuits utilizes a metallized alumina ceramic with laser drilled holes. The metallized through holes establish electrical continuity between a meatallized back plane, which serves as a very low inductance ground plane, and an upper metallized surface, which serves both power distribution and signal interconnection functions. Reliability of this circuit depends on the long term reliability of the via hole conductors.

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