Master of Science
The bilevel substrate designed for interconnecting integrated circuits utilizes a metallized alumina ceramic with laser drilled holes. The metallized through holes establish electrical continuity between a meatallized back plane, which serves as a very low inductance ground plane, and an upper metallized surface, which serves both power distribution and signal interconnection functions. Reliability of this circuit depends on the long term reliability of the via hole conductors.
Kerhsaw, R. N., "Current pulse overload test to assure the reliability of metallized vio holes in alumina substrates" (1972). Theses and Dissertations. 4042.